Biography

Professor Lane received his undergraduate degree from Emory & Henry College (’95 majors: Chemistry and Physics) and his Masters of Science and Ph.D. from Stanford University (’00, Materials Science & Engineering). He joined IBM’s TJ Watson Research Center as a research staff member in the Materials and Reliability Sciences group in December 1999. Professor Lane later managed the group before leaving IBM in 2007 to join the Chemistry Department at Emory & Henry. Professor Lane holds 37 patents, has published over 50 papers, and has received several recognitions for excellence in teaching. Many of the students who have worked in his lab have gone on to attend graduate programs at institutions such as Virginia Tech, Georgia Tech, UC Berkley, University of Kentucky, Notre Dame, Rensselaer Polytechnic Institute, University of Wisconsin, and Johns Hopkins.

Teaching

  1. General Chemistry I (CHEM 111)—Fall semester each year
  2. Inorganic Chemistry (CHEM 411)—Fall semester odd years
  3. General Chemistry II (CHEM 112)—Spring semester each year
  4. Materials Chemistry (CHEM 350)—Spring semester odd years
  5. General Education (ETLA 100 or ETLA 200) – Fall semester each year

Research Interests

The overriding goal of my research is to give Emory & Henry undergraduates an opportunity to participate in an immersive research environment. Students have the opportunity to work on significant problems associated with nanostructures and present their research at undergraduate conferences. The ultimate goal is for the work to be peer reviewed with the students as co-authors.  The underlying theme of our research is to enable innovation and design of high-performance nanostructured materials through the mechanistic study of their fracture behavior.  In particular, we study the relationship between material structure and resulting function over length-scales typically ranging from tens of nanometers to subnanometer. We are particularly interested in the relationship between the chemistry and structure of materials in thin films and their thermommechanical behavior, adhesive and cohesive fracture properties, and behavior under complex loading and environmental conditions.

Selected Publications

(* denotes undergraduate co-author)
  1. Zeng, F. W.*, Gates, S. M, Lane, M. W.; “Corrosion in low dielectric constant Si-O based thin films: Buffer Concentration Effects,” AIP Advaces 4, 057112 (2014) http://dx.doi.org/10.1063/1.4877665.
  2. Chow, P. K.; Quintero Y. C.; O'Brien, P.; Mutin, P. H.; Lane M. W.; Ramprasad, R.; and Ramanath, G.; “Gold-titania interface toughening and thermal conductance enhancement using an organophosphonate nanolayer;“ Appl. Phys. Lett. 102, 201605 (2013), DOI:10.1063/1.4807436
  3. Hall, A.B.*; Irvine, G.J.*; Gates, S.M.; Lane, M.W.; “Corrosion of Si-O based porous low-k dielectrics”, Applied Physics Letters, 101, 202901 (2012).
  4. Vijayashankar, D.; Zhu, H.; Garg, S.; Teki, R.; Ramprasad, R.; Lane, M.W.; Ramanath, G.; “Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces,” Applied Physics Letters, 99,133103 (2011).
  5. Jain, A.; Singh, B.; Garg, S.; Ravishankar, N.; Lane, M.; Ramanath, G.; “Atomistic fracture energy partitioning at a metal-ceramic interface using a nanomolecular monolayer,” Physical Review B, 83, doi:10.1103/PhysRevB.83.035412 (2011).
  6. Garg, S.; Teki, R.; Lane, M.W.; Ramanath, G.; “Factorial toughening at microcorrugated metal-ceramic interfaces,” Applied Physics Letters, 99,13, 133101 (2011).
  7. Garg, S.; Singh, B.; Teki, R.; Lane, M.W.; Ramanath, G.; “Hydrophobic fluoroalkylsilane nanolayers for inhibiting copper diffusion into silica,” Applied Physics Letters, 96, 143121 (2010).
  8. Garg, S.; Jain, A.; Karthik, C.; Singh, B.; Teki, R.; Smentkowski, VS; Lane, M.W.; Ramanath, G.; “Metal–dielectric interface toughening by molecular nanolayer decomposition,’ Journal of Applied Physics, 108,  034317 (2010).
  9. Singh, A.P.; Gandhi, D.D.; Singh, B.; Simonyi, E.; Liniger, E.G.; Nitta, S.V.; Lane, M.W.; Ramanath, G.; “Pore orientation and silylation effects on mesoporous silica film properties,” Applied Physics Letters, 94, 09350 (2009).
  10. Lane, M.W.; Roush, A.*; Callahan, S.E.*; “Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents,” in the Proceedings of the 10th International Workshop on Stress Induced Phenomenon in Metallization, 1143, 71-86 (2009).
  11. Lane, M.W.; Callahan,S.E.*, Roush, A.*; “Mechanical Scaling Trends and Methods to Improve Reliability of Packaged Interconnect Structures,” in Packaging, Chip-Package Interactions and Solder Materials Challenges, (Mater. Res. Soc. Symp. Proc. Volume 1158E) 1158-F01-01 doi:10.1557/PROC-1158-F01-01 (2009).
  12. Gandhi, D.D.; Singh, B.; Singh, A.P.; Moore, R.; Simonyi, E.; Lane, M.W.; Ramanath, G.; “Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper,” Journal of Applied Physics,106,  054502 (2009).

Extramural Research Funding

  1. Intel Corporation: Diffusion in micro-porous SiCO:H films, 2014, $8000.
  2. Intel Corporation: Diffusion in SiCO:H and SiC:H films, 2013, $12000.
  3. Intel Corporation: Diffusion in SiCO:H and SiC:H films, 2012, $12000.
  4. Collaborative Research: Understanding Mechanical and Thermal Properites and Their Coupling at nanomolecularly Modified Metal-Ceramic Interfaces, awarded by the National Science Foundation 2011-2014, $19529 per year (average)
  5. Crackstop Toughness and Scaling of 3-D Interconnects, awarded by the Semiconductor Research Corporation, 2008-2011, $15,500 per year (average).
  6. Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents, awarded by the Thomas F. and Kate Miller Jeffress Memorial Trust, 2010-2011, $10000 (renewal).
  7. Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents, awarded by the Thomas F. and Kate Miller Jeffress Memorial Trust, 2009-2010, $10000 (renewal).
  8. Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents, awarded by the Thomas F. and Kate Miller Jeffress Memorial Trust, 2008-2009, $25000.
  9. Mechanical Scaling Trends in 3-D Interconnects, awarded by the Semiconductor Research Corporation, 2007-2008, $25000.

Honors Thesis

(completed in my lab)
  1. Firebaugh, A., “Modification of silicon-oxygen based thin film surface energy via incorporation of organic moieties”, 5/2/2013.
  2. Clement, A., “Diffusion in porous SiC:H and SiCO:H thin films”, 5/2/2013.
  3. Gallagher, E., “Corrosion of SiC:H and SiCO:H thin films in buffered solutions”, 4/28/2012.
  4. Zeng, F., “Effect of pH and salt concentration on fracture of organosilicate glass thin films”, 4/28/2011.

Selected Honors and Awards

  1. State Council of Higher Education for Virginia Outstanding Faculty Award (2014)
  2. Virginia Foundation for Independent Colleges H. Hiter Harris, Jr. Memorial Award for Excellence in Undergraduate Teaching awarded by the Executive Council of the Virginia Foundation for Independent Colleges (2012)
  3. Exemplary Teaching Award given by The General Board of Higher Education and Ministry of the United Methodist Church (2010)

External Links

Educational Background

  • B.S., Emory & Henry College — Chemistry and Physics
  • M.S. and Ph.D. Stanford University — Materials Science & Engineering